Kenichi Okada received the B.E., M.E., and Ph.D. degrees in communications and computer engineering from Kyoto University, Kyoto, Japan, in 1998, 2000, and 2003, respectively. From 2000 to 2003, he was a Research Fellow of the Japan Society for the Promotion of Science in Kyoto University. In 2003, he joined Tokyo Institute of Technology as an Assistant Professor, where he is currently a Professor of electrical and electronic engineering in Institute of Science Tokyo. He has authored or co-authored more than 500 journal and conference papers. His current research interests include millimeter-wave and terahertz CMOS wireless transceivers for 20/28/39/60/77/79/100/300GHz for 5G, WiGig, satellite and future wireless systems, digital PLL, synthesizable PLL, atomic clock, and ultra-low-power wireless transceivers for Bluetooth Low-Energy, and sub-GHz applications.
Prof. Okada is a member of the Institute of Electrical and Electronics Engineers (IEEE), the Institute of Electronics, Information and Communication Engineers (IEICE), the Information Processing Society of Japan (IPSJ), and the Japan Society of Applied Physics (JSAP). He was a recipient or co-recipient of the Ericsson Young Scientist Award in 2004, the A-SSCC Outstanding Design Award in 2006 and 2011, the ASP-DAC Special Feature Award in 2011 and Best Design Award in 2014 and 2015, the MEXT Young Scientists’ Prize in 2011, the JSPS Prize in 2014, the Suematsu Yasuharu Award in 2015, the MEXT Prizes for Science and Technology in 2017, the RFIT Best Paper Award in 2017, the IEICE Best Paper Award in 2018, the RFIC Symposium Best Student Paper Award in 2019, the IEICE Achievement Award in 2019, the DOCOMO Mobile Science Award in 2019, the IEEE/ACM ASP-DAC Prolific Author Award in 2020, the Kenjiro Takayanagi Achievement Award in 2020, the KDDI Foundation Award in 2020, the IEEE CICC, Best Paper Award in 2020, the IEEE ISSCC Author-Recognition Award in 2023, and more than 50 other international and domestic awards. He is a Fellow of IEEE. He is/was a member of the technical program committees of IEEE International Solid-State Circuits Conference (ISSCC), VLSI Circuits Symposium, European Solid-State Circuits Conference (ESSCIRC), Radio Frequency Integrated Circuits Symposium (RFIC), Asian Solid-State Circuits Conference (A-SSCC), and he is/was also Guest Editors and an Associate Editor of IEEE Journal of Solid-State Circuits (JSSC), an Associate Editor of IEEE Transactions on Microwave Theory and Techniques (T-MTT), a Distinguished Lecturer and AdCom member of the IEEE Solid-State Circuits Society (SSCS).

Yongsoon Baek received the B.S. degree in physics from Seoul National University, Korea in 1991 and the Ph.D. degree for research in nonlinear optics from CREOL at University of Central Florida, US in 1997. In 1999, he joined Basic Communication Research Lab., ETRI, Korea. He has been engaged in developing optical transceivers for FTTH applications, advanced optical switches for ROADM system and optical components for 100G Ethernet transceivers. His group developed world first 400Gbps Optical Engines for hyperscale Data Centers in 2020. He is now Senior Vice President, in charge of Terrestrial and Non-terrestrial integrated Telecommunications Research Lab. at ETRI, working on developing 6G communications technology.

This presentation will examine the present state and future prospects of next-generation communication technology, represented by 6G. The objective of 6G is to advance the communication-based convergence service capabilities initiated from 5G, and enable new user scenarios such as AI integration, sensing integration, and ubiquitous connectivity.
In pursuit of this objective, emphasis is placed on the attainment of high-capacity, ultra-high-speed performance enhancements, and end-to-end ultra-low latency technologies. Notably, the development of low-Earth orbit satellite communication technology is being pursued to ensure the provision of communication services irrespective of spatial constraints. Furthermore, through the synergistic integration of artificial intelligence, we seek not only to optimize the performance and efficiency of communication services, but also to deploy diverse AI-driven services via the communication network.
Consequently, it is projected that next-generation communication will serve as the cornerstone for the creation of a wide array of novel services, extending beyond the mere transmission of information and multimedia.